Google releases Gemini big model AI mobile phone AI PC priority landing lead puzzle card making cooling hardware continues to benefit.
On December 6th, US time, Google CEO Sandahl Pichai officially announced that Gemini version 1.0 was officially launched. The released Gemini big model is a native multi-modal big model, which is the first step in the new era of Google big model. It includes three orders of magnitude: the most powerful Gemini Ultra, the Gemini Pro suitable for multi-task and the Gemini Nano suitable for specific tasks and end-sides. Now, Bard, Google’s ChatGPT-like application, has been upgraded to the Gemini Pro version, achieving more advanced reasoning, planning, understanding and other capabilities, while continuing to remain free. Google is expected to launch "Bard Advanced" early next year, which will use Gemini Ultra.
It is worth mentioning that among the 32 performance test standards, 30 of Gemini’s scores exceed GPT-4, but most of them have a small gap. In terms of flexibility, Google has introduced more options for model applications. For example, Gemini Nano, as the lightest model, is suitable for mobile devices with limited memory space. The model will be built into Google mobile phone Pixel 8 Pro for the first time in December, which supports two functions: automatic recording summarization and intelligent keyboard reply. In the future, it is expected that more functions will be put offline on Android phones.
On December 7th, the first AIPC Industry Innovation Forum was held in Beijing Lenovo Headquarters. Wang Chuandong, vice president of Lenovo Group, said that the existing form of the big model in the future should be "the framework system of mixed AI". As a terminal carrying a large model, it needs to meet four characteristics: having a strong local knowledge base and computing power, supporting natural language interaction, supporting mixed AI computing power, and being able to have a personal model. To be able to meet these characteristics at the same time, Lenovo continues to bet on AI PC.
In terms of industry, CITIC Securities believes that PC is expected to become one of the intelligent hardware with priority at the edge, considering factors such as computing power consumption, hardware volume, application scenarios and battery power consumption. Considering the continuous iteration of the algorithm level, the relatively low difficulty of the transformation of the hardware stack of AI PC, and the enthusiasm of the whole machine manufacturer for new product innovation, the penetration rate of AI PC is expected to continue to increase in the next 12-18 months, and it may exceed double digits under optimistic circumstances. Pay attention to the industrial investment opportunities of the whole machine, processor, DRAM and advanced process. At the same time, Huachuang Securities pointed out that low latency+privacy protection drives the localization demand of large models, and the hardware end and content end continue to innovate. AI PC has marginal computing power and is expected to solve the pain points in the industry and become the first AI terminal to be launched in large quantities. A number of head PC manufacturers are also conducting AI PC-related research and development and cooperation, and 2024 is expected to usher in the first year of AI PC scale shipment. AI PC can realize some AI applications on PC client, which is expected to stimulate a large number of PC replacement needs, or can drive the PC industry into a new round of rising cycle. In the industry, it is recommended to pay attention to related companies that benefit from AI hardware manufacturing, and related companies that benefit from AIPC innovation acceleration in the industry, such as Lingyizhi (002600).
It can be seen that the AI PC or AI-compatible PC terminals to be launched by major manufacturers next year will pay more and more attention to the heat dissipation function. Minsheng Electronics said in the research report "Investment Thinking of AI PC: Lightweight of Thermal Shielding" that heat dissipation is the guarantee for the performance release of AI PC. The heat dissipation performance directly determines the stability and reliability of PC performance. According to Sihan Industrial Research Institute, among the main failure modes of electronic equipment, 55% are caused by high temperature, and the failure rate of electronic components increases exponentially with the increase of working temperature. For every 10℃ increase in temperature, the reliability of the system decreases by 50%, so the heat dissipation ability of PC becomes one of the key factors affecting the overall performance.
It is understood that Lingyizhi provides customers with a variety of heat sinks, such as VC vapor chamber, graphite film heat sinks, heat pipe welding modules, copper fiber heat pipes and other products, and is the core supplier of such products. And after years of layout, in addition to the research and development and production of traditional heat dissipation components and modules, the company also provides customers with a full range of customized thermal management product solutions, providing one-stop service for design, testing and production.
Lingyizhi Manufacturing Co., Ltd. is committed to becoming the leader of the global intelligent manufacturing industry chain platform. By continuously improving its research and development capabilities and deploying vertical integration of industries, it has formed a new development advantage of combining upstream materials, midstream precision functional parts and structural parts with downstream modules and chargers, and provided customers with one-stop intelligent manufacturing services and solutions on a global scale. The market share and shipments of the company’s precision functional parts have been in the leading position in the global consumer electronics market for many years, and set industry standards in quality, technology and other aspects, and further penetrated into emerging markets such as new energy vehicles, photovoltaics and energy storage, and at the same time committed to building an AI hardware manufacturing platform.
In terms of business, the company actively stuck in the artificial intelligence hardware track, and XR, robot and other businesses set sail. The company provides soft functional parts, injection molded parts, cooling solutions, chargers and other core components for global XR customers. Recently, according to the interactive platform of Shenzhen Stock Exchange, the company continues to lay out the business of precision functional components and modules. At present, it only provides related components such as chargers for Humane’s first screenless wearable device AI Pin. AI Pin is not only a technical and hardware innovation, but also marks a potential turning point in the paradigm of human-computer interaction. In addition, the company continues to pay attention to the innovation and upgrading of frontier technologies related to robots, and actively explores their specific applications and collaboration in their own business fields. The company also applies the research and development of artificial intelligence and robots to the overall industrial solution of automatic production, and is committed to building an intelligent production workshop with internationally advanced technology and equipment level and leading domestic level, combining various and multifunctional numerical control and automation equipment independently developed, and creating an efficient modern smart factory.
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